ABSTRACT
With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni
TABLE OF CONTENTS
part |2 pages
Part 1: Introduction and Recent Developments
part |2 pages
Part 2: Mechanical Durability and Reliability Aspects
part |2 pages
Part 3: Characterization and Properties