ABSTRACT

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni

part |2 pages

Part 1: Introduction and Recent Developments

part |2 pages

Part 2: Mechanical Durability and Reliability Aspects

part |2 pages

Part 3: Characterization and Properties