ABSTRACT
The pull-force breaking strengths (mg) for 10 wire and 10 bond failures [1] are given respectively in Tables 27.1 and 27.2. The wires were bonded at one end to a semiconductor wafer and at the other end to a terminal post. Failures resulted from the breakage of a wire or a bond. The two-parameter normal model gave an acceptable characterization of the combined strengths [1]. 10 Wires Breaking Strengths (mg)
750
950
1150
1150
1150
1350
1450
1550
1550
1850
10 Bonds Breaking Strengths (mg)550
950
1150
1150
1250
1250
1450
1450
1550
2050
