Breadcrumbs Section. Click here to navigate to respective pages.
Chapter
Chapter
Adhesion of Polyimides to Various Substrates
DOI link for Adhesion of Polyimides to Various Substrates
Adhesion of Polyimides to Various Substrates book
Adhesion of Polyimides to Various Substrates
DOI link for Adhesion of Polyimides to Various Substrates
Adhesion of Polyimides to Various Substrates book
ByL. Paivikki Buchwalter
Edition 1st Edition
First Published 1996
Imprint CRC Press
Pages 42
eBook ISBN 9780203742945
ABSTRACT
Polyimides are a widely used class of high-temperature materials. They are used in microelectronics devices and packages as electrical insulators, and also find application in corrosion protection, α-particle barriers, and wire insulation for example. Polyimides (PI) are usually applied from either poly(amic acid) (PAA) or poly(amic ester) (PAE) solutions onto substrates and cured at elevated temperatures (up to 400°C) in inert ambients [1–9].