ABSTRACT
This chapter discusses the cooling technologies for microelectronic equipment from the viewpoint of their efficiency in space-constrained heat transfer, focusing on the flow boiling cooling. Also, some practical issues involved in the design of microchannel cooling systems are discussed. The flow boiling cooling system has large heat transfer capacity and advanced characteristics that can be used to realize very low thermal resistances. The chapter discusses various cooling methods. They are low-velocity air cooling, heat sinking with low speed air flow, heat sinking with high-speed impinging air flow, direct single-phase liquid cooling, heat pipe and direct phase-change cooling. In order to contain the discussion within a manageable length, a simple situation is assumed and the emphasis is placed on forced boiling cooling. Riehl et al. made a comprehensive review of the recent literature on micro-channel cooling. They compared the correlations for single-phase and phase-change heat transfer proposed by various investigators and found considerable divergence among the predicted heat transfer coefficients.
