ABSTRACT
The development of multilayer cordierite substrates in mid 1970 s by IBM has stemmed in order to replace the substrates of alumina with molybdenum vias, whose co-sintering temperature had to be over 1400°C. This technology firstly named “high temperature co-fired ceramics” (HTCC), was gradually replaced by “low temperature co-fired ceramics” (LTCC). The application of glass-ceramics with sintering temperatures below 1000°C, has facilitated the use of metals such as copper and silver, whose melting temperatures are 961 and 1083°C, respectively. (Pannhorst, 1995; Moulson & Herbert, 2003).
