ABSTRACT

The advances in silicon photolithographic process technology since 1960s have led to the development of microcomponents or microdevices, known as microelectromechanical systems (MEMS). This chapter presents a review of macro- and micro/nanotribological studies of single-crystal silicon and polysilicon, oxidized and implanted silicon, doped and undoped polysilicon films and SiC films. The fabrication techniques for MEMS devices employ photolithography and fall into three basic categories: bulk micromachining, surface micromachining, and LIGA a German acronym (Lithographie Galvanoformung Abformung) for lithography, electroforming, and plastic molding. In MEMS devices, various forces associated with the device scale down with the size. The increase in resistive forces leads to tribological concerns, which become critical because friction/stiction (static friction), wear and surface contamination affect device performance and in some cases, can even prevent devices from working. The advent of atomic force/friction force microscopy has allowed the study of surface topography, adhesion, friction, wear, lubrication, and measurement of mechanical properties, all on a micro- to nanometer scale.