ABSTRACT
Reflective and surface conductive flexible polyimide films have been prepared by the incorporation of silver(I) complexes into dimethylacetamide solutions of the poly(amic acid)s formed from 3,3′,4,4′-benzophenone tetracarboxylic acid dianhydride (BTDA), 3,3′,•4,4′-biphenyltetracarboxylic dianhydride (BPDA), and 4,4′-oxydiphthalic dianhydride (ODPA) coupled with 4,4′-oxydianiline (4,4′-ODA). Thermal curing of the silver(I)-containing poly(amic acid)s lead to cycloimidization of the polyimide precursor with concomitant silver(I) reduction yielding reflective and conductive silvered surface with properties approaching those of the native metal in selected systems. Ligand effects on the silver(I) metallization process are described using (trifluoroacetato)silver(I), (AgTFAA); (hexafluoroacetylacetonato)silver(I), (AgHFA); (trifluoroacetylacetonato)silver(I), AgTFA; 1-(2-thienyl)-3,3,3-trifluoroacetonato)silver(I) AgThTFA; (3-cyano-acetylacetonato)silver(I), AgCAA; and (2,2-dimethyl-6,6,7,7,8,8,8-heptafluoro-3,5-octadionato)silver(I), AgFOD; silver(I) nitrate, and silver(I) tetrafluoroborate. Results are also presented for the effect of BTDA/4,4′-ODA molecular weight (via viscosity measurements) on film metallization with AgTFA and for differences among the metallization of the BTDA/4,4′-ODA, ODPA/4,4′-ODA, BTDA/4,4′-ODA with AgTFA.
