ABSTRACT
Metal/polymer adhesion is a crucial issue in a variety of applications, e.g. in interconnects in IC fabrication. The adhesion strength depends strongly on the chemical structure and physical mixing at the interface. X-ray Photoelectron Spectroscopy (XPS) is well suited for determining the effect of chemical interactions on adhesion. This is demonstrated by an XPS study of the metal/Teflon AF interfaces. Monte Carlo calculations showed that both chemical and physical intermixing were important factors in enhancing metal/polymer adhesion. Two deposition techniques, Partially Ionized Beam (PIB) and Reactive Ion Assisted Interface Bonding and Mixing (RIAIBM), were developed to promote chemical reaction and physical atomic mixing during deposition. These techniques produce films with enhanced adhesion. Results of the XPS study, Monte Carlo calculations, and measurements on films produced by PIB and RIAIBM are presented and discussed.
