ABSTRACT
This study describes a water spray system optimization for a size reduction of the wet-type scrubber. Because the Wet-type scrubber is used primarily in the semiconductor manufacturing process, the mean diameter of entering solid particles into wet-type scrubber is the submicron. The impact between water droplets and solid particles is an important factor in removing the solid particles. Thus, the numerical calculations are performed for coverage area for various droplet sizes (500, 319.5, 289.5 μm) and injected directions (0, 15, 30°). The results show the coverage area ratio is about 85% in the case of droplet diameter 289.5 μm and downward direction 15°. It was shown that a coverage area increase by two times than a existing spray system.
