ABSTRACT
A new plasma method available for microelectronic technics, high current semiconductors, laser optics, magnetic disks and other technologies is presented. The basic idea, consisting in the interaction of an atmosphere high enthalpy plasma flow with the treated surface in the regime of non-stationary heat transfer is discussed. The problems of operation cleanliness, treatment rate, hydrodynamical shielding and others are reviewed. Dynamical plasma operating equipment is briefly described. Several possible technological operations provided by DPO, (photoresist stripping, etching, film deposition) are analysed.
