ABSTRACT
The fabrication of every manufactured article requires the solution of several adhesion problems among the interfaces between the various materials contained in the article. The situation becomes more and more delicate with the increasing technological level of the product considered. A semiconductor device is typical of such situation since it is constituted, from a chemical point of view, by a series of layers whose sequence and thickness is the result of a delicate balance among various needs which are often contradictory. The adhesion between the various layers is of crucial importance.
In this paper some adhesion problems currently encountered in the fabrication of a semiconductor device are reported. In particular, the interfaces between the molding resins used in the device package and the various materials which constitute the outermost part of the die are considered. In addition the adhesion between the silicon chip and the metallic frame, realized in the so-called ‘back end’ of the line with soft solder alloy, or that between polyimide and the materials of the ‘front end’ of the line is also discussed.
