ABSTRACT
This chapter begins with an introduction to the testing methodology based on digital image correlation. Digitized photographs or video sequences, as well as images from optical microscopy, scanning, electron, laser scanning, or scanning probe microscopy, are suitable for the application of digital image correlation. Tiny defects or cracks present in microsystems components can lead to severe crack propagation and complete failure if devices are stressed. Residual stresses introduced in microsystems during manufacture severely determine their reliability. Images of the object are obtained at the reference load state and at a second load state. Both images are compared with each other using a special cross-correlation algorithm. The result of a single two-dimensional discrete cross correlation and subsequent subpixel analysis in the surrounding region of a measuring point gives the two components of the displacement vector. Analysis of the thermo-mechanical reliability of whole microsystem devices is required to concentrate on weak spots, where failure behavior is initiated.
