ABSTRACT
Slicing is generally done with multi or single wire slicing systems. Parameters such as slicing speed, wire feed speed, wire tension, size, and density of abrasives are critical production parameters for slicing. Two types of slicing systems in use are conventional inner diameter saws and wire saws. The efficiency of Silicon (Si) solar cell is directly related to perfection of the surface. Surface defects during the preparation of wafer reduce the cell’s efficiency and service life. The slicing operation is a vital process for turning a-Si ingot or block into a wafer, and there is a fifty percent loss of material depending on the slicing system and wire type. The chapter considers obtaining the optimal process parameters of slicing of monocrystalline Si ingot in wafer form. The slicing operation is a vital process for turning a-Si ingot or block into a wafer, and there is almost a fifty percent loss of material depending on the slicing system and wire type.
