ABSTRACT
Mitsubishi Heavy Industries (MHI) developed a baseline shape memory polymer (SMP) foam designated MF5520 with an above-room-temperature glass transition temperature (Tg = 63°C), which was for convenience and simplicity of demonstration and testing in the Earth’s environment. The mechanical properties of MF5520 foam were tested at temperatures above and below the glass transition. Thermal properties of the foam were investigated experimentally as well as predicted from theory. The heat capacity of the foam was measured by differential scanning calorimeter (DSC). The heat capacity was found by comparing the heat input required on heating and cooling with the heat input required from a sample of sapphire, of known heat capacity, tested under identical circumstances. An outgassing test was conducted in addition to examination of the mechanical and thermal properties. The low outgassing of polymeric materials is one of major requirements for space applications.
