ABSTRACT
The chip seal design and performance evaluation is primarily based on empirical procedures. There is a need to investigate chip seal mechanical behavior via mechanistic approaches. Percent Embedment (PE) is one of the major parameters governing chip seal performance. There is very limited fundamental research aimed at understanding effect of Percent Embedment (PE) on the aggregate retention in chip seals. The objective of this study is to evaluate the effect of percent embedment of aggregates on chip seal behavior using 2D finite element approach. The experimental program involved preparation of chip seal samples and subjecting them to image analysis and conversion of images to finite element meshes. Aggregate displacement and stress analysis were conducted as part of this study. It was observed that, maximum displacement of aggregate decreased with increase in PE but followed an asymptotic trend after PE of 50%. Tensile stresses at the aggregate-binder interface decreased significantly with increase in PE. Overall, this research study highlighted the importance of PE on chip seal performance.
