ABSTRACT
Laser technologies of the precision microprocessing of foil and thin sheet materials of electronic components were developed on technological installations automated laser technological installation (ALTI) Karavella. Experimental researches on the microprocessing of materials with pulsed copper vapour laser (CVL) in the ALTI Karavella showed that a bump is formed from the cooled molten metal at threshold radiation power levels on the side of the laser beam exit along the edge of the cut. The problem of developing methods for cleaning the contaminated zone formed by microprocessing with pulsed radiation of CVLs was sharply raised. The choice of a solution for cleaning the laser treatment products should be determined by testing the final cleaning technology for specific parts. The chapter investigates the influence of speed, number of passes and radiation power on laser processing on the structure, roughness and hardness of the material in the region adjacent to the cutting zone.
