ABSTRACT
The analysis of interfacial stresses of dissimilar anisotropic media induced by thermal mismatch is particularly important in micro electronic mechanical systems. In this work, a general solution for a thermorheologically anisotropic trimaterial is presented. Based on the method of analytic continuation associated with the alternation technique, the solutions of heat conduction and thermoelastic problems for three dissimilar media are derived. A rapidly convergent series solution for both the temperature and stress field, which is expressed in terms of an explicit general term of the corresponding homogeneous potential, is obtained in an elegant form. The hereditary integral in conjunction with the Kelvin-Maxwell model is applied to simulate the thermoviscoelastic properties while a thermorheologically simple material is considered. Based on the correspondence principle, the Laplace transformed thermoviscoelastic solution is directly determined from the corresponding thermoelastic one. The real time solution can then be solved numerically by taking inverse Laplace transform. Finally, some typical examples of interfacial stresses induced by a remote heat flux are also discussed. The results show that the interfacial shear stresses almost remain constant for time evolution while the interfacial normal stresses decrease with time because of the thermoviscoelastic effect.
