ABSTRACT
Slip lines generated by radiation heating with ring holder have been characterized with the photoelastic technique useful in evaluating residual and/or process-induced strains. It is found that slip lines are strongly reflected in two-dimensional distribution maps of shear strain component, rather than tensile strain component. The slip lines along the (011) directions are clearly observed mainly in the (001) peripheral regions of 4"-diameter (100) wafers processed in the temperature range of 400~600C.
