ABSTRACT
This introduction presents an overview of the key concepts discussed in the subsequent chapters of this book. The book provides an overview of thermal design and measurement in electronic enclosures. It describes the methodology of scaling. The book identifies many parameters that require measurement. Velocity, temperature, and pressure were identified as the “primary” ones requiring detailed measurement. It describes methodology for measuring these parameters. The book shows that conduction heat transfer plays a significant role in thermal transport of electronic systems. It also covers the process of heat flux measurement using specialized gauges. The book deals with special cases in thermal management. It discusses the full spectrum of component characterization methods and the use of electrical parameters for temperature measurement. The book also deals with generation of noise and its control in electronic systems.
