ABSTRACT
This chapter deals with experimental methods and analyses related to the thermal characterization of packaged semiconductor devices, commonly referred to as “components.” Thermal characterization of a semiconductor device is the determination of the temperature response of the semiconductor circuit junctions due to internal self-heating. The chapter covers the application of the electrical test method to a variety of device functional categories. These categories are determined by the electrical design of the die utilized in the specific component under test. Devices can be divided into two categories for thermal testing: two-terminal and three-terminal. The chapter also covers the issues and differences in powering these two device types. It deals with the topic of transient, nonequilibrium component characterization. The heating characterization represents a type of cross-sectional view of the internal thermal resistances and capacitances of a component as depicted.
