ABSTRACT
Numerous challenges are associated with the fabrication process of the microelectromechanical system (MEMS) pressure sensor. Selecting the best suitable fabrication process and materials out of the available materials and techniques for engineering purposes is a complex task. In this chapter, a non-conventional e-beam approach has been utilized for the deposition of a polycrystalline thin film, which has replaced conventional approaches such as the reactive ion etching and low chemical vapor deposition. The rapid development of IC technology in recent years has reduced the dimension of the sensor with an increase in the complexity in the fabrication of VLSI chips. Therefore, detailed virtual fabrication steps have been shown through the DevEdit tool of SILVACO. This software provides the complete process to be followed during fabrication. Researchers and engineers get the full layout without going through the actual process and fabrication steps, which reduces the cost and time significantly.
