ABSTRACT
In this paper, we present an analytical model for solid-solid contact in thermal transient states. It has already been shown that a thermal contact in steady state can be characterized, for most cases, by an association of five resistances. These correspond to the resistance of the interstitial fluid, the two constriction resistances and the two asperity resistances. In transient regime, it is shown that the preceding resistances are replaced by transfer matrices. The solid-solid contact is modeled then by an association of five transfer matrices.
The “two-pair terminal network” (quadrupole) concept is first presented in the case of a wall under transient thermal stress. The form of the transfer matrix corresponding to the constriction of flux lines is derived and given in both the case of a semi-infinite medium and of a finite medium.
Finally, these results have been used to model two types of solid-solid contact: the plane contact of two surfaces of large dimensions, and the thermal contact between a sample and a thermocouple.
