ABSTRACT
The possibility of immersing high-power dies in coolant liquid has long been considered a method for dealing with high power density integrated circuits. An experiment was conducted in which three bare dies mounted on a multichip module (MCM) were exposed directly to a stream of dielectric cooling fluid for achieving high heat flux removal. The goal of this immersion cooling feasibility experiment was to prove suitability for cooling devices in excess of 100W/cm2, while maintaining a junction temperature below 85°C. The impact of individual die heat spreaders and baffles was also explored and proved to have a large impact on dies temperature. Ananoscale thermal interface material and a dielectric ternary nanofluid was introduced and tested for increasing performance of the cooling system. The test results with and without the nanomaterials were evaluated and reported.
