ABSTRACT
Rising computational power of electronic chips has resulted in increase in the heat generation rates; with the current demand of miniaturizing electronic devices, the space available to dissipate the heat generated is limited. Therefore, the need is to incorporate new methods to design a heat sink which can dissipate more heat in the limited space available. Heat sinks with perforated pin fins is one such possibility. In order to examine the effect of perforation size, five different perforation diameters are considered, and their performance is compared with the solid pin fins over a wide range of Reynolds number ranging from 8000 to 22,000. The consistency of performance trends is analyzed by considering two different perforation pitches. It has been observed that the heat transfer rate has been augmented due to greater surface area offered by perforated fins compared to solid pin fins, while the pressure drop across the heat sink is reduced, which is attributed to the lesser obstruction to the flow.
