ABSTRACT
This chapter presents the design and simulation of flexible devices to demonstrate the feasibility of high-frequency flexible building blocks for the development of high-performance foldable electronics. It reviews the recent developments in the field of high-frequency flexible electronics, the main concepts necessary for understanding the subject, and the possible applications of electronics flexible as well as the associated perspectives and challenges. Starting from the limitations intrinsically associated with current organic electronics that confine it to low-frequency applications. The chapter discusses various solutions suggested to enhance flexible electronics capabilities. Most of them are based on the hybridization of flexible organic substrates with thin inorganic nanostructures featuring high charge carrier mobilities. Several “technology boosters” have been explored by the semiconductor industry to solve scaling limits and also meet the International Roadmap for Devices and Systems requirement, such as the use of high-k dielectric gate stacks, new channel materials, stress engineering, or alternative chip structures such as fully depleted silicon-on-insulator.
