ABSTRACT
This introduction presents an overview of the key concepts discussed in the subsequent chapters of this book. The book discusses the thermal dissipation technique of multichip packaged LEDs for cost-effective lighting applications and the thermal transfer model to predict the temperature gradient uniformity, which could inevitably induce unbalanced stress along the multichip LED interface to cause output degradation. It discusses the “Modeling and simulation of Ge/Si nano-disk array for QD-based IBSCs”. The book performs a low-cost and large-area synthesis method such as sputtering is employed for fabricating Si- or Ge-based PVSCs, and a multi junction Si/SiGe-Ge PVSC. It presents several types of fiber amplifier which could be used in communication and sensing, including EDFA, RFA, hybrid fiber amplifier (EDFA+RFA), and high-power fiber amplifier. The book presents several waveguide-based high-speed Si/Ge/Sn photo detectors, including Si/Ge hetero junction waveguide pin, Si/Ge butt-coupling waveguide photo detectors, and GeSn photo detectors.
