ABSTRACT
In this chapter, the methods of the preparation and formulation of thermally curing compositions using ED-20 epoxide resin and imide of 4-sulfoisophthalic acid, as well as anhydride of 4-sulfoisophthalic acid are presented. The thermal properties of the obtained polymer compositions have been investigated by DTA and TGA methods. The developed composition materials have thermal stability, heat resistance, and also high values of the thermogravimetric index (TGI). The thermostable compositions can be used in the electric-technical industry for coatings of the copper wires of mounting wires, electro-technical contacts, and also in potting compounds.
