ABSTRACT
Advanced ECDM process tries to take part in the industrial field for the production of micro-features on non-conducting materials, and increasing machining depth (MD) is a challenging task during micro-machining performances. The basic characteristics, fundamentals, and advanced micro-ECDM setup development, as well as feeding system and tool holding device, have been developed and analyzed in this chapter for increasing MD during micro-features generation in hard materials like glass, silicon-wafer, and various ceramics. The chapter also consists of the effects of process parameters like pulse frequency (PF), duty ratio (DR), applied voltage (V), and concentration of electrolyte (EC) on machining criteria such as rate of material removal, surface roughness, diametric or width of overcut, MD and heat affected zone (HAZ) during micro-machining operation by ECDM process. This chapter also addresses some merits and demerits as well as the utility of the micro-ECDM process.
