ABSTRACT
The phenomena occurring during the electric-field-assisted bonding of zirconia ceramics to copper and nickel plate and during strengthening of adhesion of plasma sprayed zirconia coatings on copper are clarified. It was found that a Zr-Cu-O layer formed at the cathodic interface between the zirconia and copper, causing adhesion. Similar results were obtained in the bonding of zirconia ceramic to nickel plate.
In the case of a zirconia coating sprayed onto a copper substrate, a similar reaction layer also formed at the cathodic interface, significantly increasing the adhesive strength.
