ABSTRACT
In the last couple of decades, solid-state device technologies, particularly electronic semiconductor devices, have been greatly advanced and investigated for possible adoption in various tera-hertz (THz) applications, such as imaging, security, and wireless communications. Meanwhile, researchers have been exploring ways to package those THz electronic devices and integrated circuits for practical use. Packages are fundamentally expected to offer physical housing for devices and reliable signal interconnections from the inside to the outside or vice versa. However, as frequency increases, we face several challenges associated with signal loss, dimensions, and fabrication. This chapter provides a broad overview of the recent progress in interconnections and packaging technologies.
