ABSTRACT

The continuous drive to enhance semiconductor performance has led to significant advancements in MOSFETs. As device miniaturization approaches its fundamental limits, traditional gate dielectrics like SiO2 suffer from performance degradation due to increasing leakage currents and gate tunneling effects. To address these challenges, the incorporation of high-k gate dielectrics has emerged as a critical solution. This chapter highlights the importance of high-k gate dielectrics in multi-gate FETs. First, it addresses the limitations of conventional SiO2 as the gate insulator, emphasizing the constraints posed by the thickness scaling to preserve the gate control over the channel. Second, it explores the remarkable properties of high-k materials, such as higher permittivity, lower gate leakage, and improved carrier mobility, which effectively overcome the obstacles faced by traditional gate dielectrics. A nanosheet FET has been designed wherein the impact of high-k dielectrics on different temperatures, single-k, and dual-k spacer materials is examined.