ABSTRACT
Substrate coupling in mixed-signal integrated circuits (ICs) and especially in wireless communications Systems-on-Chip (SoCs) create important performance degradation of the Analog/RFMS (RF and Mixed Signal) circuits integrated on the same die as large digital systems. Couplings occur between noise transmitters, which in most cases, are fast switching digital blocks, and a noise receiver, which in most cases, is a sensitive Analog, RF block or mixed signal architecture and takes place due to the capacitive and resistive nature of the substrate-devices interface.
