ABSTRACT
As known, the main purpose of a system-on-chip (SoC) in an electronic product is to offer a complete system within a single chip, using additionally no components or only a reduced number of them (as high precision analogue circuits, quartz crystals, high capacity memories, passive components). The advantages of SoC are package size, easy-to-integrate package, flexibility, cost efficiency for high volume production, direct communication and full compatibility between internal blocks, low power consumption, small printed circuit board (PCB), and others. With shrinking on-chip technologies, voltage levels are being more and more reduced, lowering noise margins required to enable a correct design from signal integrity (SI), and electromagnetic compatibility (EMC) perspectives. For this reason, SoC/chip packages are quintessential pieces of the signal integrity landscape and PCB represents the backbone of the future electronic system/product.
