ABSTRACT
Mixed-signal System-on-Chip (SoC) with both analog, RF and digital blocks implemented onto the same die are increasingly developed in many applications and especially in wireless communications and wireless sensor node interfaces. However, integrating these blocks onto the same silicon causes important performance degradation especially in applications requiring fast-digital circuits and high-performance analog/RF blocks. Fast switching in digital blocks generates noise which is propagated through the common substrate to the analog/RF circuits. Coupling occurs between a noise transmitter, which is usually a fast switching digital block or blocks, and a noise receiver, which in most cases, is a quite sensitive analog or RF block and takes place due to the capacitive/resistive nature of the substrate and the devices interface.
