ABSTRACT
Fabrication of devices in micro-/nanometer scales requires microelectromechanical systems (MEMS) technology which allows for static or moveable elements for sensing and actuation purposes. This chapter provides an overview of the basic MEMS fabrication methods. Developed from the modern complementary metal-oxide-semiconductor (CMOS) process, MEMS enables the integration of different functions with electronic circuits, thus is a key technology for the fabrication of future devices. A standard MEMS fabrication process includes lithography, thin-film formation, etching, and bonding and packaging. Various materials such as silicon, polymers, metals, and ceramics are used and must be processed in micro-/nanometer scale. The following section describes the fundamental MEMS process steps in detail.
