ABSTRACT
Assembly of three-dimensional (3D) mesostructures in advanced materials opens up many new application opportunities across a broad range of areas. Mechanically-guided assembly that replies on controlled, compressive buckling of 2D precursors represents an emerging method of great promise, due to the versatile applicability, not only to a diverse set of materials (from soft polymer to plastic metal and brittle inorganic semiconductors), but to a broad range of length scales (from submicrometer to centimeter dimensions). This paper presents a short review on various key aspects of this approach, including the basic principle, mechanics-inspired design concepts, and theoretical modeling of the assembly process. In particular, the kirigami/origami inspired designs, releasable multi-layer designs, and engineered substrate designs, are discussed in detail.
