ABSTRACT
This chapter describes the basic subassemblies commonly used within deliverable electronic units and the assembly processing associated with each subassembly. It demonstrates how these subassemblies are grouped together to form new assemblies, which are then used as the building blocks for larger assemblies. The chapter discusses the integration of these assemblies to form the final system. It shows how components such as bare dice and capacitors are the building blocks of many electronic assemblies. Electronic assemblies consist of any number of electronic and nonelectronic devices that are grouped together to perform a function. Most subassemblies are manufactured as deliverable, self-contained units, built at various facilities. The tabs used for die assemblies are metallized ceramic or metal that has been plated to allow for proper mounting and wire bonding. The parts used within a system are commonly listed according to the subassemblies they make up.
