ABSTRACT
SUMMARY The hybrid electrical/optical multi-chip integration technique for optical modules for optical network system has been developed. Employing the technique, a 4x4 broadcast-and-select type optical matrix switch module has been realized. The module consists of four sets of silica waveguide 1:4 splitters/4 : 1 combiners, four 4-channel arrays of polarization insensitive semiconductor optical amplifiers with spot-size converters as optical gates, printed wiring chips for electrical wiring and single mode fibers for optical signal interface on planar waveguide platform fabricated by atmospheric pressure chemical vapor deposition. All the gates and the wiring chips were mounted precisely onto the platform at once in flip-chip manner by self-align technique using AuSn solder bumps. Coupling loss between the waveguide and the SOA gate was estimated to be 4.5 dB. Averaged fiber-to-fiber signal gain, on-off ratio and polarization dependent loss for each of the signal paths was 7 dB ± 2 dB, more than 40dB and 0.5 dB, respectively. High speed 10 Gb/s photonic cell switching as short as 2nsec has been successfully achieved.
key words: hybrid photonic integration, semiconductor optical amplifier, planar lightwave circuit, optical gate switch, flip-chip bonding, spot-size conversion, optical switching, photonic ATM suntch “optical fiber communication, optical network
