Alleviating Thermal Constraints while Maintaining Performance via SIlicon-Based On-Chip Optical Interconnects

Growing transistor densities, less than ideal scaling of global wires, and increasing clock frequencies have led to excessive interconnect wire delay and significant heat dissipation in general-purpose microprocessors. The industry

CONTENTS

14.1 Introduction ................................................................................................. 339 14.2 Optical System ............................................................................................ 341

14.2.1 Modulator ........................................................................................ 341 14.2.2 Receiver ............................................................................................342