ABSTRACT
The rating of an electronic or electrical device depends on the capability of the device to dissipate heat. As miniaturization continues, engineers are more concerned about heat dissipation and the change in properties of the device and its material makeup with respect to temperature. In the commonly used model for materials, heat is a form of energy associated with the position and motion of the material’s molecules, atoms, and ions. The position is analogous with the state of the material and is potential energy, whereas the motion of the molecules, atoms, and ions is kinetic energy. Temperature is a measure of the average kinetic energy of a substance. It can also be considered a relative measure of the difference of the heat content between bodies. Solids are materials in a state in which the energy of attraction between atoms or molecules is greater than the kinetic energy of the vibrating atoms or molecules.
