ABSTRACT
Polymer nanocomposites have been developed for practical use in electric power applications. For example, epoxy-based nanomicrocomposites have been developed for solid insulated switch-gear (SIS). This kind of switchgear is environmentally friendly and uses solid insulation systems instead of sulfur hexafluoride (SF6) gas insulation systems. Moreover, cross-linked polyethylene nanocomposite has been developed to prevent space charge accumulation and is used in insulation systems in DC power cables. With the development of power electronics technology toward recent promotion of energy saving, many inverter-fed motors are used in electric vehicles or hybrid vehicles. As compactness and high performance of electronic devices progress, there is an increasing demand for high-density mounting of electronic components. In high-performance electronic devices, high-density mounting of components is adopted. This chapter describes nanocomposites and nano-microcomposites for use in the field of information science, or specifically as sealing resins for semiconductor devices and packaging, underfill materials used in semiconductor flip-chip mounting, and capacitor materials.
