ABSTRACT
Multiplexing (OFDM) modulation, the PA also needs to have a high linearity. Most traditional PAs used in RF use gallium arsenide (GaAs) semiconductor processes, but these are expensive and cannot be integrated with silicon-based CMOS (complementary metal-oxide-semiconductor) processes (Ishikawa and Honjo, 2013; Williams et al., 2011; Chen et al., 1996). Although the use of CMOS processes can reduce the cost, designing an RF PA with high output power and high linearity is difficult with CMOS. Even though a CMOS PA has some problems, it can be integrated with other circuit function blocks to form a single IC that supports System-On-a-Chip (SOC). Thus, recent research on CMOS PAs has become an industry trend (Tsai and Ouyang, 2014).
