ABSTRACT
Materials like semiconductors or dielectrics can show a completely different behaviour; for example, silicon and silicon carbide show a decreasing reflectivity and an increasing optical penetration depth with increasing wavelength. In this case, the heat transfer can be described by the well-known heat diffusion equation: where is the lattice heat capacity per unit volume , the thermal conductivity and Q the source term reading, following, for a given intensity distribution of a wave propagating in z-direction:. Multi-beam and direct patterning combined with today's standard scanning technologies are promising approaches on the way to kW laser micromachining. The situation totally changed in the early noughties when first industrial-ready ultra-short pulsed laser systems became available. A user has often the challenge to increase the throughput of a laser machining process by keeping its quality. The throughput is finally, besides many other process parameters, a question of the average power.
