ABSTRACT
T2 pure copper was studied by conducting the tensile test that especially concerns the effects of grain size on its damage behavior. Experimental results show that, damage and fracture of T2 pure copper are greatly associated with evolution of their microstructure under loading. The evolution behavior of the microstructure is important to realize the damage and fracture mechanism of materials. With an increase in strain, the damage factor of T2 pure copper increases. At room temperature, T2 pure copper has a shorter deformation edge and earlier deformation than annealed materials. With an increase in the annealing temperature, T2 pure copper has a longer deformation edge and delayed deformation, and the need for greater strain to break the threshold. The fitting evolution equation can reflect the evolution law of the microstructure of T2 pure copper at different annealing temperatures.
