ABSTRACT
Lapping is defined as a chipping process involving a relatively low volume of material removal. In this process, material removal takes place due to the cutting action of loose abrasive particles distributed in a medium (fluid or paste or lapping slurry), which move in a undirected cutting pattern on the work surface with the help of a lapping tool (similar to a copying tool). During lapping, a group of geometrically dissimilar cutting edges remove unwanted material in a simultaneous and slow (rpm < 80) cutting action from the work surface and can finish almost any material. A suitable range of size of abrasive particles used is 5-20 μm. These abrasive particles are suspended in a viscous or liquid vehicle (such as soluble oil, mineral oil or grease) during cutting action. Lapped surfaces can be categorised as smooth and flat but
CONTENTS
3.1 Introduction .................................................................................................. 59 3.2 Description of Process ................................................................................. 61
3.2.1 Metal Removal Process ...................................................................63 3.2.1.1 Kinematic Principle ..........................................................63 3.2.1.2 Lapping Methods ..............................................................63
