ABSTRACT
Realistic throughput estimates in the single slice approach to a manufacturing line would be between 30 and 100 wafers per day. The single slice approach is initially aimed toward the development of advanced material and device structures and the small-scale manufacturing of leading devices and integrated circuits. Recalling that the principle of molecular beam epitaxy (MBE) is simpler than that of any other growth method for doped semiconductor matrices with arbitrary profiles, hence such a design philosophy would exactly correspond to the principle of MBE. A Si-MBE design of greatest simplicity will be achieved only for all absolutely necessary process steps, subsystems, and components which will result in an elegant, flexible, reliable, and cost-effective solution for industrial applications. Hence, production line managers, normally of conservative outlook, are extremely careful before introducing production conditions requiring new technological operating conditions, reliability, material quality, and costs.
