ABSTRACT
Many fields of study require deformation measurements of tiny specimens or tiny regions of larger specimens. The mechanics of microelectronic assemblies is an example where the ever-increasing demand for closer packing exacerbates the problems of thermal stresses. Other fields include crack-tip analyses in fracture mechanics, grain and intragranular deformations of metals and ceramics, fibre–matrix interactions in fibre-reinforced composites, interface problems etc.
