ABSTRACT
This chapter deals with hybrid Microelectronics Technology. The hybrid technology is an integration of two or more technologies, utilizing a film-deposition process to fabricate conductor, resistor, and dielectric patterns on a ceramic substrate for the purpose of mounting and interconnecting semiconductors and other devices as necessary to form an electronics circuit. The foundation for the hybrid microcircuit is the substrate, which provides the base on which the circuit is formed. The modern hybrid era began in the 1960s when the first commercial cermet thick-film materials became available. Thick-film technology is an additive process that utilizes screen printing methods to apply conductive, resistive, and insulating films, initially in the form of a viscous paste, onto a ceramic substrate in the desired pattern. The chapter describes properties of Thick-Film Dielectric Materials and deals with cermet thick-film materials, as these are most directly associated with the hybrid technology.
