ABSTRACT
Successful radio frequency (RF) and microwave package design involves adherence to a rigorous and systematic methodology in package development together with a multi-disciplined and comprehensive approach. The mechanical analysis must encompass attachment of the RF or microwave component or module to the customer system. Thermal management is probably one of the most critical aspects of the package design because it not only contributes to catastrophic circuit overload and failure in out-of-control conditions, but it could also contribute to reduced life of the product and fatigue failures over time. From mean time before failure point of view, the thermal aspects of the circuit/package interaction are one of the most important aspects of the package design itself. The mechanical design usually occurs concurrently with thermal analysis and heat transfer management. The mechanical package designer may develop several simulations with various materials to input into the cost-reliability matrix.
